IWLPC- Wafer-Level Packaging Conference & Exhibition

The IWLPC-Wafer-Level Packaging Conference & Exhibition brings together some of the semiconductor industry’s most knowledgeable experts to discuss all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing.

Event Contact
Address: DoubleTree by Hilton Hotel San Jose, San Jose, USA
Phone: TBC
Email: info@chipscalereview.com
Organizer
1. Auto & Automotive 2. Electric & Electronics 3. Medical & Pharma 4. Packing & Packaging 5. Industrial Engineering 6. Telecommunication 7. Science & Research 8. Business Services
In the United States of America, the Surface Mount Technology Association (SMTA) was founded in 1984. SMTA provides exclusive access to local and global communities of experts, as well as accumulated research and training materials from thousands of companies dedicated to advancing the electronics industry, for electronics engineering and manufacturing professionals seeking to improve processes through best practises and real-world solutions.