International Conference on Electronics Packaging

Final manuscript must fit in two pages, including figures, tables, and photographs. PDF files that are not IEEE Xplore compliant will not be included in the Proceedings nor published. It is strongly recommended that you use the IEEE PDF eXpress plus site to convert your Word Document file to the PDF format. Submit your source file in MS Word (.doc) format for conversion to PDF format. Your paper will get a unique ID code as the file name.
25 minutes are allotted to each presenter including 20 minutes presentation and 5 minutes Q&A. The submission system will be open from February 7, 2022 until April 25, 2022 (JST).

Event Contact
Address: Sapporo Community Plaza, Hokkaido
Phone: TBC
Email: info@jiep.or.jp
Organizer
1. Electric & Electronics 2. Packing & Packaging
IEEE Components Packaging and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research design and development of revolutionary advances in microsystems packaging and manufacture.
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