- Event Date23 Jun, 2021 - 25 Jun, 2021
- Event Time10:00 am - 5:00 pm
- Category
- Event PriceFree
Adhesion & Joining Expo Osaka
Event Description
Adhesion & Joining Expo Osaka will cover areas like Adhesive Agents, Adhesive Tapes, Adhesive Films, Raw Materials/Additives, Coating Equipment, UV Curing Equipment, VOC Purification Equipment, Drying Equipment, and Cleaning Equipment.
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[event_end_time] => 17:00
[event_email] => materialweek-e@reedexpo.co.jp
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Event Contact
Address: INTEX Osaka, Japan
Phone: TBC
Email: materialweek-e@reedexpo.co.jp
