Adhesion & Joining Expo Osaka

Adhesion & Joining Expo Osaka will cover areas like Adhesive Agents, Adhesive Tapes, Adhesive Films, Raw Materials/Additives, Coating Equipment, UV Curing Equipment, VOC Purification Equipment, Drying Equipment, and Cleaning Equipment.

Event Contact
Address: INTEX Osaka, Japan
Phone: TBC
Email: materialweek-e@reedexpo.co.jp
Organizer
1. Exhibitions & Events 2. Conferences 3. Trade shows 4. Business Development
Reed Exhibitions Japan Ltd. is a part of Reed Exhibitions, a global enterprise based in 24 countries/regions around the world.